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Single Crystal Silicon Ingot
High-Purity, Large-Diameter Silicon Material for Semiconductor Dry Etching
Single Crystal Silicon is a critical raw material for high-performance consumable components used in semiconductor plasma etching processes. These components are continuously exposed to demanding plasma environments and therefore require high purity, excellent crystal uniformity, and stable electrical properties.
Truly supplies high-purity, large-diameter Single Crystal Silicon Ingots specifically designed for semiconductor dry etching applications.
Our Single Crystal Silicon Ingots are grown using CZ (Czochralski) and MCZ (Magnetic Czochralski) technologies and are available in a wide range of diameters, conductivity types, dopants, and resistivity specifications to meet diverse customer requirements.
To support the increasing demand for larger and more advanced etching components, our product portfolio includes large-diameter Single Crystal Silicon Ingots up to 600 mm class and beyond.
Through rigorous raw-material control and advanced crystal-growth technology, our ingots provide high crystal uniformity, stable electrical characteristics, and consistent quality, supporting precision machining and reliable performance in demanding semiconductor etching environments.
Key Features
High-Purity Single Crystal Silicon
● Large Diameter: Up to 600 mm Class and Beyond● CZ / MCZ Crystal Growth● Various Resistivity Specifications● P-Type / N-Type Available● Customized Specifications
Key Applications
Semiconductor Dry Etching Components
● Silicon Electrode● Silicon Ring
● Silicon Plate● Other Silicon Consumable Parts for Plasma Etching
Truly provides reliable Single Crystal Silicon Material Solutions optimized for precision machining and high-performance semiconductor dry etching components.